Nexperia and Semikron Danfoss have signed a memorandum of understanding to jointly develop silicon carbide (SiC)-based power modules for automotive traction inverters, targeting next-generation electric vehicle drivetrains.
Strategic rationale
The partnership combines Nexperia’s SiC semiconductor design and fabrication expertise with Semikron Danfoss’s power module packaging and integration capabilities. Both companies recognize that SiC technology is critical for improving efficiency, power density, and thermal performance in electric drivetrains. By aligning chip-level and module-level engineering from the outset, they aim to deliver scalable, high-performance solutions that meet the rigorous reliability and cost requirements of automotive OEMs.
Technical approach
The collaboration will focus on joint engineering and early-stage co-design, integrating Nexperia’s SiC MOSFETs into Semikron Danfoss’s module platforms. This vertical alignment reduces parasitic losses and thermal bottlenecks that often limit system-level performance in discrete implementations. The companies will evaluate how their combined value chain—from wafer fabrication to module assembly—can optimize power density and switching efficiency for 800V and higher-voltage architectures.
Industry context
Wide-bandgap semiconductors, including SiC and gallium nitride (GaN), are increasingly central to automotive electrification strategies. However, achieving full system-level benefits requires tight coupling between device design and module packaging. Nexperia’s senior VP for wide-bandgap, Edoardo Merli, noted that early-stage collaboration is essential to aligning semiconductor and system requirements. Semikron Danfoss’s Carsten Götte emphasized that the combination of advanced chip technology and module expertise can create additional customer value in a rapidly evolving EV market.
Forward outlook
This exploratory agreement signals a broader industry trend toward vertical integration and co-development in power electronics. If the collaboration advances to production, it could shorten time-to-market for SiC-based traction modules and lower system costs for EV manufacturers. The outcome will depend on how effectively the two firms bridge process and packaging engineering—but the strategic logic is clear: in wide-bandgap power, the whole is greater than the sum of its parts.
