Fabs & Manufacturing

Advanced PackagingDiamond

A New York diamond bet targets heat inside AI packages

Entegris has acquired Advanced Abrasives and partnered with Element Six to sell silicon carbide and diamond materials as thermal interfaces for AI packages.

Odisha starts building chip plants it sold as a mining pivot

Odisha starts building chip plants it sold as a mining pivot

Bosch will run its chip unit as a foundry from 2028

Bosch will run its chip unit as a foundry from 2028

Marvell will swallow Lumentum and hand over a third of itself
AI infrastructureLumentum

Marvell will swallow Lumentum and hand over a third of itself

Fab ConstructionSamsung

Texas paperwork points at Sherman for a $45B two-fab chip project

Advanced PackagingASE Technology

An OSAT lifts its packaging target and sells optics too

Advanced Packagingchip investment

A Korean packager turns to a state fund as bonds get expensive

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