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Advanced Packagingchip manufacturing

Intel taps Lens Technology for glass substrate chip packaging

Intel partners with Lens Technology to develop glass substrate packaging for AI chips, targeting higher interconnect density and better thermal performance.

AMD launches Helios rack as its boldest challenge to Nvidia yet

China chip exports nearly double to $177B in first half

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Memory chip stock market correction
AI infrastructureDRAM

Memory stocks enter bear market after record AI rally

ASML EUV lithography capacity surge
AI chipsAsml

ASML posts EUR 9.3B quarter, plans 30 percent EUV capacity surge

AI infrastructureByteDance

ByteDance targets second half 2027 for custom in-house CPU production

capital expenditureEUV

Samsung and SK Hynix push $580 billion expansion that strains tool supply

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