Thursday, 5 Nov 2026
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Articles
Memory & Storage
Samsung to put High-NA EUV on DRAM lines by 2028
September 9, 2026
Fabs & Manufacturing
Chip industry sizes up 12-inch photomasks for the High-NA era
September 9, 2026
Memory & Storage
SK hynix pushes 1c DRAM past 1b as main process next year
September 7, 2026
Memory & Storage
Sellout looms as Samsung and SK hynix memory stock hits 10 days
September 7, 2026
Industry & Markets
Bankrupt GaN maker’s ex-researcher faces trial over China chip secrets
September 7, 2026
Fabs & Manufacturing
TSMC joins Taiwan alliance to steer co-packaged optics push
September 7, 2026
Industry & Markets
TSMC 3nm output heads toward record quarter as Rubin ramps
September 7, 2026
Processors
Huawei’s logic-folding Kirin 9050 Pro debuts inside Mate XT 2
September 7, 2026
AI Silicon
Coatue explores chip-financing venture with AI startup MatX
September 6, 2026
Design & Tools
Siemens synthesis now ships with Japanese startup’s FPGAs
September 6, 2026
Industry & Markets
Chip tool billings set another record at $40.5B in Q2
September 6, 2026
Memory & Storage
Micron races to nearly double HBM capacity in AI memory push
September 6, 2026
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