Intel has formed a strategic collaboration with Lens Technology to develop glass substrate packaging for advanced semiconductors, aiming to serve AI, data center, and high-performance computing applications. The announcement came from the two companies on July 24.
The partnership pairs Intel’s expertise in semiconductor architecture and advanced packaging with Lens Technology’s capabilities in precision glass processing and laser manufacturing. Together, they intend to accelerate glass substrate development, which promises finer interconnects, better thermal stability, and higher power efficiency than traditional organic packaging materials.
“Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency,” said Intel CEO Lip-Bu Tan. He noted that the companies can explore new approaches to system-level innovation for the AI era.
Lens Technology founder and chairwoman June Chau said the collaboration will accelerate innovation in advanced packaging and support next-generation computing solutions for customers worldwide.
Glass substrates offer key advantages over silicon and organic interposers used in today’s advanced packages. They support larger panel formats, flatter surfaces for finer lithography, and superior thermal performance — all critical as chipmakers stack more dies inside single packages for AI accelerators.
Intel already ships advanced packaging technologies including EMIB and Foveros and has been expanding its packaging capacity. The Lens Technology deal broadens Intel’s materials supply chain for its foundry business, which aims to manufacture chips for external customers.
Beyond packaging, the two companies see potential in AI PC components, high-reliability thermal solutions for data center servers, and hardware platforms for AI robotics and edge computing.
