As AI clusters scale from racks to rows of accelerators, moving data between chips has become as critical as compute itself. STMicroelectronics believes silicon photonics on 300mm wafers is the answer.
ST is ramping its PIC100 silicon photonics platform on 300mm wafers while developing the packaging and electrical integration needed to place optical interconnects closer to processors and switch ASICs. The company first entered the space a decade ago with a 200mm PIC25 platform but shelved commercial production when the market was not ready.
“The killer application wasn’t there,” said Sylvie Gellida, general manager of ST’s Optical and RF Foundry Division. “All the planets are now aligned, and we’re on time to address this market.”
Industry data backs the move: the silicon photonics market is projected to reach $3.7B in 2026, and analysts expect all AI data center interconnects to shift to optical within five years. ST joins TSMC and GlobalFoundries in expanding 300mm silicon photonics production as tooling and process maturity reach volume thresholds.
The key challenge remains packaging — integrating optical engines close enough to compute silicon without sacrificing yield or thermal performance. ST’s PIC100 platform targets 100GBaud signaling, supporting 200G-per-lane optical links for next-generation AI clusters.
