Advanced packaging materials are in the spotlight at a Suwon trade fair this week as Korean suppliers chase AI data center demand.
Epsilon, a domestic materials maker, is using the Advanced Semiconductor Packaging and Chiplet Show, which runs Aug. 26-28, to debut products aimed at power and signal handling in AI servers and GPUs.
Its lineup includes a copper-based die attach paste designed to pull heat away from power semiconductors while trimming cost. Those components manage the electricity flowing through servers and accelerators, and efficiency there is becoming a priority as data centers grow.
The company is also pushing interference-blocking materials and adhesives for increasingly small packages, where chips packed close together can disrupt one another’s signals. Silver-coated copper figures in the shielding offering.
Engineers will staff the booth for consultations, and meetings with overseas buyers are scheduled during the event. Epsilon’s management called the show a chance to establish its products in the global semiconductor back-end market.
