Xiaomi’s next foldable puts homegrown CXMT memory inside

Lei Jun celebrates the LPDDR6 ramp that will make the 18 Fold the first phone with CXMT's new DRAM.

ChipNews Staff
1 Min Read

China’s DRAM champion is about to appear inside a flagship phone for the first time. Xiaomi’s 18 Fold, due in September, will use memory from CXMT, whose LPDDR6 parts have just entered mass production.

Xiaomi founder Lei Jun posted the news himself, congratulating CXMT on the ramp and calling his company’s XRING O3 chipset the first designed for the new standard. The foldable’s launch in China next month makes it the first device on the market with CXMT’s latest DRAM.

The parts themselves are a step change for the Hefei-based maker. Peak transfer rates reach 12,800 Mbps. Capacity scales to 16GB on a single chip, comfortably ahead of the LPDDR5X parts CXMT shipped previously.

The win matters beyond one phone. Samsung, SK hynix, and Micron have dominated premium mobile memory, and CXMT’s entry gives China a native seat at that table. The company says it has already sent samples to key customers and is scaling up output.

Lei Jun used the moment to push for more collaboration across Chinese tech, pointing to the XRING O3’s production on TSMC’s N3P node as a model. Full specifications for the 18 Fold remain under wraps for now.

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