Synopsys has widened its work with TSMC, certifying its digital and analog design flows on the foundry’s A14 process and building agentic AI into the implementation path.
The two companies describe a methodology running from implementation through signoff, aimed at teams wrestling with AI and high-performance computing designs that keep growing in scale.
On the analog side they reached device routing enablement for A14, a step that opens the door to automated place-and-route for analog layouts. Analog automation has long trailed the digital side of chip design.
The agreement also covers multiphysics-aware signoff and multi-die design flows, plus interface and foundation IP already proven in silicon. Much of the value sits in that combination, because advanced-node adoption stalls when certified tools and validated IP do not arrive together.
Synopsys senior vice president Michael Buehler-Garcia framed the package as a continuum of silicon-to-systems co-design. TSMC’s Aveek Sarkar, who runs ecosystem and alliance management, said certified tools and a proven IP portfolio are what let customers push performance and energy efficiency on the newest processes. Both work through TSMC’s Open Innovation Platform, the vehicle the foundry uses to coordinate third-party design enablement.
