TSMC has pushed its next-generation 1.4nm fab construction ahead of the original timeline, with the first building at the Central Taiwan Science Park expected to be completed before April 2027, according to the park administration.
Supply chain sources indicate that if construction continues at its current pace, pilot production could begin as early as the start of the third quarter of 2027. Mass production could follow by mid-2028, earlier than previously reported estimates that targeted the second half of 2028.
The first two of four planned fab buildings have already entered the steel structure phase, with foundation piling largely complete. Contracts for the fab buildings have been awarded in stages, and work has advanced to the central utility plant and office buildings.
TSMC said during its latest earnings call that its A14 (1.4nm-class) process has made rapid progress over the past three months, tracking well ahead of N2 at the same stage of development. Internal validation shows transistor performance approaching 90 percent of target with nearly 90 percent yield for a 256Mb SRAM. Customer interest remains strong across both smartphone and AI/HPC applications.
Intel also plans to begin high-volume manufacturing using its 14A (1.4nm-class) process in 2028, while Samsung has resumed efforts to commercialize its SF1.4 process with mass production now slated for 2029.
