The challenge of multi-die interconnects
Advanced packaging is driving a fundamental shift in chip design. Multi-die architectures now require managing millions of interconnects through bumps and through-silicon vias (TSVs). Manual planning of these structures is error-prone, time-consuming, and does not scale.
Engineers must balance signal integrity, power delivery, and thermal constraints across heterogeneous dies. The interconnect density in 2.5D and 3D packages has increased by an order of magnitude in recent generations, making automation a critical requirement.
Synopsys delivers automated planning and analysis
Synopsys has introduced a new methodology that automates bump and TSV planning, visualization, and analysis. The solution integrates directly into existing design flows, enabling engineers to define, place, and verify interconnect patterns programmatically.
Key capabilities include rule-driven bump pattern generation, TSV placement optimization, and real-time electrical analysis. The tool can handle millions of interconnects while maintaining design rule compliance and improving overall productivity. This eliminates the iterative manual loops that have historically slowed multi-die package development.
Visualization and verification at scale
The platform provides interactive 3D visualization of the entire interconnect stack, from bump arrays through TSVs to redistribution layers. Engineers can inspect cross-sections, measure distances, and validate connectivity across die boundaries.
Automated verification checks for signal integrity, electromigration, and thermal hotspots. The analysis engine runs in parallel across the full package, delivering results in minutes rather than days. This enables rapid design-space exploration and early detection of interconnect-related failures.
Looking ahead
As multi-die designs become the norm for AI, HPC, and networking ASICs, efficient interconnect planning is no longer optional—it is a competitive necessity. Synopsys’s automated approach reduces weeks of manual work to hours, while improving design quality and reducing risk. Expect this capability to become a standard requirement in advanced packaging workflows as interconnect densities continue to scale.
