SK Hynix will formally break ground on its first US advanced packaging plant on August 27, marking a milestone in the memory maker’s push to build high-bandwidth memory closer to American AI customers.
The ceremony takes place in West Lafayette, Indiana, where the company is investing $3.87B in a packaging and research facility dedicated to HBM production.
Both Chey and Kwak are expected to attend alongside executives from major technology companies and suppliers, with Huang’s presence still unconfirmed even though the two groups have deepened their partnership on AI data centers and memory supply.
The plant answers a strategic need: HBM stacks must be packaged near advanced logic and customers, and US demand for AI accelerators keeps climbing.
SK Hynix already supplies HBM to Nvidia and has committed billions to new memory capacity worldwide, including a stalled Dalian NAND line in China that it recently revived.
Indiana officials have courted the project since 2024, when the state offered incentives to land one of the largest foreign investments in its history.
The facility also lets SK Hynix hedge against geopolitical friction by putting advanced packaging on US soil.
Construction follows a wave of US memory and packaging investment as AI workloads strain supply chains.
The August 27 ceremony will signal how quickly the company can move from ground-breaking to production-ready HBM capacity.
