Silicon Box has shipped 500 million units from its Singapore panel-level packaging plant, a fivefold jump since October, and says it will expand production capacity tenfold this year.
The milestone, announced August 5, positions the chiplet integration specialist as a scale player in advanced packaging just as AI demand strains conventional supply. Panel-level packaging processes large panels instead of individual wafers, cutting cost and raising throughput for AI accelerators, and Silicon Box says it holds industry-leading yield at volume.
The push comes as TSMC’s CoWoS capacity stays constrained and OSAT rivals such as ASE pour record capital into packaging. Analysts see panel-level methods as one answer to the packaging bottleneck that has become a choke point of the AI supply chain, alongside 2.5D and 3D stacking.
Singapore has become the proving ground for the technology, and the 10X capacity plan signals confidence that hyperscaler demand will absorb the extra output.
