ASMPT reported third-quarter revenue of HK$5.25 billion, about $669 million and 49 percent above a year earlier, with almost all of the growth coming from the division that packages finished dies rather than the one that sells wafer-processing gear.
Thermo-compression bonding carried the quarter. The technique presses a memory stack onto an accelerator, and demand for it has risen as high-bandwidth memory layer counts climb. The advanced packaging unit had already posted record first-half revenue of $339 million, with bonding sales up 146 percent.
The semiconductor solutions segment, which sells the machines that pattern and process wafers, came in below analyst estimates, and the company still logged record group bookings for the period.
The split says something about where the AI build-out now pinches. For most of the boom, the constraint was how fast wafers could leave a leading-edge foundry. Packaging capacity is now sold out years ahead, and the tools that stack and join dies have become their own bottleneck.
Chipmakers are spreading the work. AMD routes roughly half of its packaging orders to outside assembly houses rather than waiting on a single supplier. The shift turns a back-end step into a strategic purchase, and it gave ASMPT its strongest quarter even as the front-end side disappointed.
