The electric vehicle charging world is about to get a serious jolt. Infineon just dropped the EasyPACK C, a next-gen power module package that’s built to handle the brutal, fluctuating demands of fast DC charging, megawatt stations, and industrial energy storage.
The first chip to ride in this new package is a silicon carbide (SiC) power module featuring Infineon’s latest CoolSiC MOSFET G2 transistors. That’s a mouthful, but here’s what matters: these modules are designed to survive harsh conditions and deliver way more power without frying themselves.
The 20x Lifespan Leap
Infineon is making some bold claims. Compared to the last generation of CoolSiC MOSFETs, these new modules offer over 30% higher power density and—get this—up to 20 times longer lifetime. The secret sauce? A proprietary .XT interconnection technology that physically bonds the chip to the package better, reducing thermal stress.
They’ve also slashed the on-resistance (RDS(on)) by about 25%. That means less energy wasted as heat, which is a huge win for sustainability-minded engineers trying to squeeze every watt out of a system. The new EasyPACK C housing itself is designed for future higher-voltage classes, so this isn’t just a one-off upgrade—it’s a platform.
PressFIT and 200°C Overloads
The modules can handle overload switching conditions up to a scorching 200°C. New PressFIT pins double the current capacity while actually lowering temperatures at the PCB level, and a fresh plastic material and silicone gel keep things stable at a continuous 175°C. There’s also a 3kV AC isolation rating for one minute, which is crucial for safety in high-voltage industrial gear.
Infineon is rolling out these modules in a variety of topologies, from 3-level to H-bridge configurations, with or without thermal interface material. The first units are available now, and the company promises to expand the portfolio as demand grows.
What This Means
This isn’t just a spec bump. By packaging SiC MOSFETs in a rugged, high-density housing with better thermal management, Infineon is directly targeting the bottleneck in EV charging infrastructure: reliability under constant, heavy use. If these modules deliver on that 20x lifespan promise, we’re looking at charging stations that don’t need to be replaced every few years—and that’s a big deal for the grid of the future.
