Saturday, 20 Jun 2026
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225
Articles
Industry & Markets
Purdue and Taiwan’s GCCS partner to scale silicon carbide substrates to 8- and 12-inches
June 9, 2026
Fabs & Manufacturing
Trailing-edge foundry roadmaps for globalfoundries, UMC, and SMIC — mature node chipmakers each pursue differing strategies and IP
June 9, 2026
AI Silicon
Leaks reveal US authorities concerned about the rise of ‘anti-tech extremists’ as AI data center issues become increasingly
June 9, 2026
Design & Tools
AI in design verification: from experimentation to measurable capability
June 9, 2026
Processors
Qualcomm announces Snapdragon C platform for $300 and up laptops — Windows on Arm and NPUs for the budget tier
June 9, 2026
Processors
Chinese university builds 3D chip design tool tailored to Huawei’s ‘LogicFolding’ architecture
June 9, 2026
Fabs & Manufacturing
IQE completes £81m fundraising
June 9, 2026
Processors
ASRock BC-250 used for Steam Machine duty gains third-party hack to unlock all 40 CUs
June 9, 2026
Fabs & Manufacturing
Chiplets, ecosystems, and Europe’s post-fab semiconductor strategy
June 9, 2026
Fabs & Manufacturing
Observability is essential for modern silicon
May 31, 2026
AI Silicon
Using systemc TLM modeling to solve AI data movement challenges
June 9, 2026
Fabs & Manufacturing
Polar Semiconductor and Nexperia partner on power MOSFET manufacturing
June 9, 2026
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