JCET’s board raised the company’s 2026 capital expenditure budget from RMB 9.98B to RMB 17.31B, a jump of more than seventy percent that pushes the Chinese assembly house deeper into advanced packaging.
The move came with third quarter results showing the payoff. Revenue for the quarter reached a record RMB 11.43B, up 13.5 percent from a year earlier and 10.3 percent sequentially. Net profit attributable to shareholders was RMB 770M, 60 percent higher year on year. Across nine months, net profit excluding one-off items almost doubled.
Computing electronics did the heavy lifting. Sales into AI data center infrastructure, covering compute, memory, interconnect and power parts, climbed 54 percent and supplied 30.9 percent of group revenue in the first nine months. Automotive electronics grew 30 percent as a Shanghai plant came online.
The spending goes toward high-end capacity at JCET Microelectronics in Jiangyin and a new project in Shanghai. The company said it is developing glass substrate and panel-level packaging with several customers, with those programmes now moving to pilot-line construction.
It also claims co-packaged optics capability through its XDFOI platform, where it has built heterogeneous integration of photonic and electronic circuits and can package optical engines alongside switching and computing dies.
That places a mainland supplier in two races that are usually framed as Taiwanese and Korean: moving from round wafers to rectangular panels, and putting light inside the package. Gross margin widened 2.3 percentage points over nine months as the product mix shifted. The test now is whether RMB 7B of extra tools arrives before the customers who asked for them build a second source.
