Hanmi Semiconductor has launched the 2.5D TC Bonder 40, a chip-on-wafer bonding tool targeting AI system semiconductors, and will supply it to global foundries and OSAT companies.
Product lineup expansion
The 2.5D TC Bonder 40 extends Hanmi’s advanced packaging portfolio, following the FC Bonder 75 last year and the FC Bonder 3.5 in June 2024. The new system supports ultra-large dies and multi-chip integration processes critical for AI chip manufacturing. It handles die sizes from 3x3mm to 40x40mm, enabling flexible processing across varied applications.
Market and technology context
2.5D packaging has become foundational for AI and high-performance computing. Major adopters include NVIDIA, AMD, Broadcom, Marvell, and Apple. Key technologies include TSMC’s CoWoS and Intel’s EMIB, with evolution toward CoPoS and 3D SoIC. The advanced packaging market is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, a 9.5% CAGR, per Yole Group.
Key technical features
The bonder is specialized for the chip-on-wafer process used in CoWoS. It incorporates Auto Conversion technology for uninterrupted processing of multiple chip types and Reel Feeder Loading to maximize equipment uptime. An optional Fluxless Bonding feature reduces fine defects and improves reliability.
Strategic implications
The launch aligns with Hanmi’s establishment of Hanmi USA, set to open by year-end. The subsidiary aims to strengthen supply chain partnerships with U.S. AI companies, foundries, OSAT firms, and memory hubs from the chip-planning stage. Hanmi plans to leverage its global leadership in TC Bonder for HBM to capture share in the growing 2.5D system semiconductor packaging market.
Forward outlook
The 2.5D TC Bonder 40 positions Hanmi to serve rising demand for multi-die integration in AI accelerators. As foundries scale CoWoS and EMIB capacity, precise, high-throughput bonding equipment becomes a bottleneck. Hanmi’s diversified portfolio and U.S. expansion strategy suggest sustained revenue growth, contingent on execution in a competitive advanced packaging landscape.
