Cadence and Samsung Foundry have expanded their multi-year agreement to deliver a certified design platform for second-generation 2nm and 3D-IC technologies, targeting surging AI infrastructure and physical AI demand.
Expanded ip and tool certification
The collaboration extends Cadence’s portfolio of Memory and Interface IP to include NVIDIA NVLink-C2C-enabled interconnect and CUDA-X GPU-accelerated libraries across high-speed SerDes, PCIe, UCIe, and leading memory interfaces on Samsung’s second-generation 2nm node. Cadence’s digital, custom, 3D-IC, and system design and analysis flows—including Innovus, Virtuoso, Integrity 3D-IC, Voltus, Quantus, and Tempus—are now certified for production use. This provides ecosystem partners with a signoff-ready platform for large AI, HPC, and advanced system designs, targeting higher performance, lower power, and faster time to tapeout.
3d-ic design on Samsung 3d cube-h
Samsung’s 3D Cube-H design is enabled with a full system planning, implementation, and signoff flow for hybrid copper bonding (HCB) technology. Key tools include Cadence Cerebrus, Integrity 3D-IC, Innovus, Voltus IC Power Integrity, and Pegasus Verification System. The flow incorporates silicon interposer auto-routing and optimization, ensuring tighter connectivity between analysis, signoff, and verification for trusted design closure.
NVIDIA and ambarella adoption
NVIDIA is leveraging the expanded platform to deliver high-bandwidth interconnect via NVLink-C2C and CUDA-X GPU-accelerated capabilities, powering next-generation accelerated computing systems. Ambarella is developing its next-generation 2nm edge AI platform using Cadence IP for PCIe 5.0, targeting ultra-low-power AI perception and physical AI SoCs for robotics, drones, and autonomous machines. Both companies cite the signoff-ready, co-optimized IP and tools as critical for managing design and manufacturing complexity at advanced nodes.
Forward-looking significance
This deepened partnership signals that the semiconductor ecosystem is converging on a standardized, certified design platform for the most demanding AI workloads. With production-proven tools and IP for 2nm and 3D-IC, Cadence and Samsung are positioning themselves as a go-to enabler for the next wave of AI infrastructure and physical AI systems across data center, edge, and intelligent devices.
