Every wafer of TSMC’s newest node is spoken for before the tools are even installed, so the foundry is telling suppliers how much more it intends to build. Its first 2027 capacity plan, reported by the Economic Daily News, lifts 2nm output 22 percent and 3nm more than 16 percent from the end of this year.
In wafer terms, 2nm climbs from 90,000 a month at the close of 2026 to 110,000 by mid-2027. The 3nm line goes from above 180,000 to 210,000 a month.
3nm is on course to pass 5nm as the foundry’s largest revenue contributor, a shift that would have looked distant two years ago when the node was still ramping.
Three new 3nm fabs are being added across Taiwan, Arizona and Japan while 5nm equipment in Taiwan is converted to the newer node. Capital spending for 2026 was guided at $60B to $64B in July.
Packaging is on a parallel track, with CoWoS volume expected to double between the end of 2026 and the end of 2028, centered on the AP7 site in Taiwan and the Arizona campus.
