GlobalFoundries has unveiled FDX Fusion, an FD-SOI platform aimed at physical AI, with manufacturing planned for 2028 at its Dresden, Germany site.
The company describes it as the most advanced FD-SOI technology it has put on a roadmap. The target is what it calls STAC workloads: sensing, thinking, acting and communicating, the loop that robots, vehicles and edge systems have to close in real time.
The first generation is expected to reach seven-nanometer-class digital performance and deliver more than double the density of GlobalFoundries’ first-generation FDX technology.
The platform combines substrate engineering, transistor changes, and back-end interconnect work. It adds RF performance up to 0.5 THz ft/fmax, analog and mixed-signal features, low-leakage operation, in-memory computing and embedded non-volatile memory alongside dense logic.
Ed Kaste, a senior vice president in the company’s CMOS business, said physical AI is creating a new class of requirements as intelligence moves out of the cloud and into devices that interact with the physical world.
The bet is that the edge and the cloud will need different silicon. Rather than compete at the leading node, GlobalFoundries is positioning FD-SOI as the power-efficient option for systems that must sense and respond locally. Dresden becomes the anchor for that strategy in Europe.
