GlobalFoundries will manufacture silicon interposers for TSMC’s CoWoS advanced packaging line, under a five-year agreement that adds capacity at its Malta, New York plant.
The deal, valued around $2 billion, establishes the first US-based source of the interposer substrates that sit beneath AI accelerators. Volume production is expected to begin ramping at Malta in the first half of 2028, and the agreement sets a framework for later expansion.
The arrangement has GlobalFoundries supplying a manufacturing service to its larger rival rather than competing with it head-on. The work includes embedded deep trench capacitor components, a feature used to steady power delivery across dense chip packages.
CoWoS capacity has been among the tightest links in the AI supply chain, as accelerator demand outpaces the packaging lines that assemble logic dies with stacks of high-bandwidth memory. Placing interposer production on US soil also reduces the geographic concentration of a step that had been centered in Taiwan.
Ed Kaste, a senior vice president at GlobalFoundries, framed advanced packaging as increasingly central to performance, power efficiency and scale for next-generation AI systems. The company said the US footprint gives customers a secure and scalable source of essential packaging elements.
The supply-chain question now follows the demand: how quickly can the tooling and cleanroom space at Malta be brought up to serve an industry that keeps pulling forward its capacity targets.
