Advanced Semiconductor Engineering reported September revenue of NT$88.13 billion, or about $2.7 billion, up 7.15 percent from August and 45.52 percent year over year.
It was the third consecutive monthly record for the Taiwanese outsourced assembly and test provider, pushing quarterly revenue above NT$200 billion for the first time.
The gains track sustained demand for advanced packaging, the back-end step where logic dies and high-bandwidth memory stacks are joined into accelerators. Capacity for those processes has been tight across the industry, with ASE itself having raised advanced packaging quotes earlier this year.
Peer suppliers have expanded in parallel. SPIL, the ASE affiliate, broke ground on a TWD 100 billion plant dedicated to chip-on-wafer-on-substrate work, and Amkor has been weighing a sale of a stake in its Shanghai operation.
Analysts expect the packaging bottleneck to persist while accelerator makers ramp designs that pair larger logic dies with more memory layers, keeping pressure on outsourced capacity into next year.
