Taiwan’s science and technology council has opened a public comment window on the next slice of the Chiayi Science Park, and the supply chain reads it as the starting gun for a much larger packaging build-out. Reporting in the Liberty Times says TSMC intends to add five more advanced packaging plants on the site.
That would take the company’s total there to ten, a concentration big enough to make the southern park the industry’s largest packaging cluster.
Chiayi is already partway down that road. Two facilities sit in the first phase, where output began in June, and equipment is being installed in the second. Three more plants are planned for that stage, with construction of the first already under way and completion of all three targeted for 2031.
The new land covers almost 199 hectares, mostly leased from the state sugar company. Development is pitched at AI chips, heterogeneous packaging, silicon photonics and high-speed networking. The plan needs a month of public comment, then feasibility work and an environmental review before cabinet sign-off.
Behind the expansion sits CoWoS, the packaging format that glues logic dies to stacked memory. Demand from Nvidia, AMD and Apple has kept that capacity short, and every extra plant buys the island more of the AI supply chain at a moment when rivals are trying to move in.
