The tightest link in AI hardware is not the logic die but what holds it together. Hanmi Semiconductor is taking that opening, shipping the first of a new bonding machine aimed at AI processors rather than memory stacks alone.
The FC Bonder 75 works on interposers up to 75mm square. Conventional packages in this class use a working area of roughly 20mm a side, so the new tool widens the surface a processor and its memory can share.
Hanmi declined to name the buyer, describing only a global customer. Until now the Korean company’s franchise has been thermal compression bonders for high-bandwidth memory. This machine opens a second line of business in equipment for GPUs and custom accelerators.
A US arm, Hanmi USA, starts up in October, aimed at selling closer to American cloud operators and chip designers.
Interposer size sets a hard ceiling on how many memory stacks sit beside a processor, and memory capacity is the number buyers watch most closely. That is why 2.5D and 3D assembly became the bottleneck of the AI supply chain.
Bigger working areas also demand more force control and tighter alignment as bump pitches shrink. The move puts Hanmi against established suppliers already installed in foundry and outsourced assembly lines.
