China’s industry ministry and its top economic planner released the 15th Five-Year Plan for electronic information manufacturing on Tuesday, and integrated circuits sit at the top of the agenda.
Chips are treated as the base for AI, next-generation communications, aerospace and smart devices, so the document’s first priority under foundational industrial capability goes to breakthroughs across the whole supply chain rather than single weak links.
The wording reaches across six segments: design, manufacturing, packaging and testing, equipment, materials and EDA software. Targets include high-performance processors, high-density memory and reliable analog or mixed-signal parts, plus refined mature processes alongside work on leading-edge nodes. The plan also names industrialization of ultra-wide-bandgap materials such as gallium oxide and diamond.
On scale, it calls for revenue from large electronics manufacturers to pass ¥30 trillion ($4.5T) by 2030 with R&D intensity of 3.5 percent. Hitting that means adding roughly ¥10T of revenue in five years.
Momentum is already strong. Electronics manufacturing revenue reached ¥9.41T in the first half of 2026, up 18.5 percent, while profit nearly doubled to ¥577.7B. Analysts read the document as a shift from patching weak spots to rebuilding the supply chain end to end, with choke points named among the priority tasks.
