TSMC is preparing broad price increases on its manufacturing services for 2027, with baseline wafer prices on advanced nodes rising 5 to 10 percent and certain production services facing hikes as steep as 25 percent, according to industry reports.
The foundry giant’s pricing action reflects persistent capacity tightness driven by insatiable AI accelerator demand, rising equipment costs from ASML’s next-generation High-NA EUV lithography tools, and TSMC’s own aggressive capital expenditure plans. The company raised its 2026 capex to $64 billion and recently committed an additional $100 billion to US fab investments.
TSMC’s advanced nodes, including N3 and N2 class processes, are effectively sold out through 2027, giving the company significant pricing leverage. The company has not commented officially on the reported price targets, but semiconductor clients including Nvidia, AMD, Qualcomm, and MediaTek have all been informed of the changes.
The hikes mark one of TSMC’s most aggressive pricing moves in recent years and are expected to ripple through the AI supply chain, raising the bill of materials for everything from data center accelerators to smartphone processors. Foundry ASPs have already grown at roughly 16 percent annually since 2019.
