Infineon Technologies AG is showcasing its full semiconductor portfolio for power infrastructure, AI data centers, electro-mobility, and robotics at PCIM Europe 2026 in Nuremberg, Germany (9–11 May, booth 470, hall 7).
Portfolio breadth across silicon, sic, and gan
Infineon is presenting a comprehensive range of power system solutions spanning silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) semiconductors. These are complemented by software, tools, and cybersecurity expertise, addressing the full value chain from discrete devices to system-level designs.
Power infrastructure and AI data centers
As renewable energy scales and AI workloads surge, robust power infrastructure becomes critical. Infineon is demonstrating technologies for battery storage systems, uninterruptible power supplies (UPS), solid-state transformers (SST), and solid-state circuit breakers (SSCB). Highlights include SST demo stacks and SSCB components based on CoolSiC JFET technology, enabling fault isolation within microseconds for future DC grids.
For AI data centers, Infineon is presenting a Si, SiC, and GaN portfolio supporting the shift toward HVDC sidecars and DC microgrids. Exhibits include power semiconductors, drivers, microcontrollers, and sensors for advanced power supply units, battery backup units, intermediate bus converters, voltage regulation, and intelligent protection devices.
Electro-mobility and robotics
Infineon is advancing electro-mobility with solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems. The “One Inverter, One Infineon” system solution aims to improve drivetrain efficiency while optimizing space and cost. Additional demos feature CoolSiC and CoolGaN power switches, EasyPACK S and CIPOS Prime modules, XENSIV sensors, and AURIX TC4xx microcontrollers.
In robotics, Infineon is showcasing semiconductors for industrial and domestic robots, humanoids, and drones. Demos include high-efficiency motor control and power management using CoolGaN devices, PSOC Control C3 microcontrollers, and XENSIV sensors, enabling compact designs and precise operation.
Cybersecurity compliance
Across all focus areas, Infineon is highlighting its commitment to security under the EU Cyber Resilience Act. Experts at the booth are addressing how secured-by-design semiconductor solutions help customers meet regulatory requirements while strengthening product differentiation.
Infineon is also contributing to the PCIM conference program and expo stages.
The company’s integrated approach—spanning silicon, SiC, and GaN, plus software and security—positions it to address the converging demands of energy efficiency, AI compute density, and regulatory compliance across multiple high-growth markets.
